Copper Sputtering Targets

Browse copper sputtering targets for seed-layer deposition and semiconductor metallization. Surface condition, flatness and the target-to-backing interface are practical review points when matching a target assembly to the cathode drawing.

See the current copper sputtering target for material, surface and assembly information.

Information for a Target Enquiry

Send required purity, impurity limits, target shape, dimensions, tolerances and quantity. Include your equipment drawing, flatness and surface requirements, backing or bonding requirements where applicable, and inspection or material documents for confirmation.

Read the purchasing guide or send your target requirements for a quotation.