Description
High-Performance Tantalum Sputtering Target – Ultra-Pure Ta Target for Precision PVD Coating
🔹 Overview
Tantalum sputtering targets are vital components in the development of high-performance thin films using physical vapor deposition (PVD) technologies. Our High-Performance Tantalum Sputtering Target is meticulously manufactured from ultra-pure tantalum (≥99.95%) to ensure exceptional sputtering efficiency, minimal contamination, and superior mechanical stability. These targets are widely used in semiconductor production, aerospace coatings, medical device fabrication, and chemical processing industries.
Manufacturing involves high-end techniques such as electron beam melting (EBM) or vacuum arc remelting (VAR), followed by controlled forging, rolling, annealing, and CNC machining. The result is a sputtering target with optimal microstructure, superior bonding characteristics, and stable deposition performance.
🔬 Chemical Composition (Typical – ≥99.95%)
| Element | Content (wt%) |
|---|---|
| Tantalum (Ta) | ≥ 99.95% |
| Oxygen (O) | ≤ 0.015% |
| Nitrogen (N) | ≤ 0.01% |
| Carbon (C) | ≤ 0.01% |
| Hydrogen (H) | ≤ 0.0015% |
| Niobium (Nb) | ≤ 0.01% |
| Iron (Fe) | ≤ 0.005% |
| Tungsten (W) | ≤ 0.01% |
Compliant with ASTM B708 for tantalum and tantalum alloy plates, sheets, and foils.
⚙️ Mechanical & Physical Properties
| Property | Value |
| Density | 16.6 g/cm³ |
| Melting Point | 3017°C |
| Electrical Resistivity | ~13.5 μΩ·cm |
| Hardness | 90–160 HV |
| Grain Size | ≤ 100 μm |
| Surface Roughness | ≤ 20 μin Ra |
| Flatness Tolerance | ≤ 0.05 mm/100 mm |
| Purity Levels | 99.95%, 99.99%, 99.999% (custom) |
These optimized properties support consistent Tantalum sputtering target behavior in high-precision coating systems.
🌟 Key Benefits of Our Tantalum Sputtering Target
- 🔹 Ultra-High Purity: Minimizes contamination during PVD processes.
- 🔹 Stable Microstructure: Provides even material erosion and film deposition.
- 🔹 Custom Shapes & Sizes: Planar, rotary, step, or rectangular formats.
- 🔹 Superior Bonding Options: Indium or diffusion bonding to Cu/Mo backers.
- 🔹 Corrosion & Thermal Resistance: Ideal for harsh vacuum or reactive atmospheres.
📐 Dimensions & Customization
We offer tailored Tantalum sputtering targets to suit various coating systems:
- Planar Target Diameter: 25 mm to 300 mm
- Rectangular Size: Up to 300 mm × 400 mm
- Thickness Range: 1 mm to 25 mm
- Custom Bonding: Indium, epoxy, or diffusion bonded
- Backer Materials: Copper, molybdenum, stainless steel
Optional:
- ✅ Reverse engineering from spent targets
- ✅ CAD/CAM drawing support
- ✅ OEM/ODM prototyping
🧪 Application Fields
Tantalum sputtering targets are engineered for high-performance coating in multiple industries:
- 🖥 Semiconductors: Barrier layers and interconnects in DRAM, CMOS, and logic chips
- 🧪 Chemical Processing: Corrosion-resistant coatings for valves and reactors
- 💡 Display Technologies: Used in TFT, OLED, and touchscreens
- 🔬 Optical Systems: High-index and anti-reflective coatings for lenses
- 🚀 Aerospace: Thermal coatings for navigation and propulsion systems
- 🔋 Battery & Energy Storage: Protection layers in lithium-ion batteries
- 🏥 Medical Devices: Biocompatible coatings for surgical instruments and implants
📜 Certification & Standards
- ✅ ASTM B708 Standard
- ✅ RoHS/REACH compliant materials
- ✅ Mill Test Certificates (EN 10204 3.1)
- ✅ ISO 9001 / ISO 14001 certified facility
- ✅ Non-Destructive Testing (NDT) reports upon request
Each Tantalum sputtering target is quality-controlled from raw powder to final delivery.
📦 Packaging & Logistics
- 📦 Double vacuum-sealed in anti-static foil
- 🧼 Packed in Class 1000 cleanroom conditions
- 🛫 Global express shipping via DHL/FedEx/TNT
- 📄 Export paperwork including COO, MSDS, MTC
- 🌍 Export license support available for restricted regions
🏭 Production Process
- Powder Analysis: Raw tantalum powder is tested via ICP-OES/LECO.
- Melting: EBM/VAR melting for uniform chemistry.
- Deformation Processing: Forging, rolling, annealing under inert gas.
- CNC Machining: Custom shapes with micron-level tolerances.
- Bonding (Optional): To Cu or Mo backers using clean bonding agents.
- Inspection: Surface, dimensional, and ultrasonic NDT checks.
📊 Why Choose NiTiCu Metal
NiTiCu Metal delivers high-purity refractory materials to demanding industries across the globe. Our strength lies in precision machining, rapid prototyping, and strict QC practices.
Why work with us?
- 🧠 Expertise in sputtering efficiency
- 🏭 ISO-certified manufacturing base in Baoji, China
- 📈 Custom design for multilayer and compound sputtering
- 🔁 In-stock standard targets for fast delivery
- 📩 Technical and logistic support in <24 hours
📞 Contact Us
📧 Email: sales@niticu.com
📞 Phone / WhatsApp / WeChat: +86 13335373172
🏭 Factory: Baotai Road Industrial Park, High-tech Zone, Baoji City, Shaanxi, China
🌐 Website: https://niticu.com
📩 Request drawings, datasheets, and pricing today — we respond within 24 hours!
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