Description
C11000 Copper Foil and Strip
πΉ Overview
C11000 Copper Foil is electrolytic tough pitch (ETP) copper flat stock. Select thickness, width, coil or cut-sheet form, temper and surface finish for the intended electrical, forming or shielding component.
The catalog lists a minimum of 99.90% pure copper and identifies UNS C11000. Use ASTM B152 as a flat-product specification reference where it matches the ordered form. Agree the required dimensions, electrical tests, surface condition and inspection for PCB, transformer, battery-tab or EMI/RFI-shielding enquiries.
C11000 copper also possesses excellent fatigue resistance, a key feature for flexible circuits and components subject to frequent thermal or mechanical stress. Its low magnetic permeability and high recyclability make it a sustainable and functional material for a wide range of environmentally conscious engineering designs.
π§ͺ Chemical Composition (Typical)
| Element | Content (wt%) |
|---|---|
| Copper (Cu) | β₯ 99.90% |
| Oxygen (O) | β€ 0.04% |
C11000 is oxygen-bearing ETP copper. Specify the heated joining process, atmosphere and material inspection for the part; select oxygen-free material by its own grade and oxygen requirements when that is the drawing requirement.
βοΈ Mechanical & Physical Properties
| Property | Typical Value |
| Tensile Strength | 220β385 MPa |
| Yield Strength | 65β200 MPa |
| Elongation | β₯ 30% |
| Hardness | 40β85 HV (depending on temper) |
| Density | 8.89 g/cmΒ³ |
| Electrical Conductivity | β₯ 100% IACS |
| Thermal Conductivity | ~390 W/mΒ·K |
| Melting Point | 1083Β°C |
Select temper and thickness for stamping or forming, and specify surface treatment and adhesion requirements for lamination. For flexible circuits or shielding tapes, agree bend duty, geometry, electrical continuity and the required application tests with the drawing.
π‘ Key Features
- π Superior Electrical Conductivity for signal transmission and EMI shielding
- π₯ High Thermal Conductivity for thermal dissipation in batteries and electronics
- π§ Excellent Malleability and ductility for ease in forming and fabrication
- π§ͺ Corrosion-Resistant for use in humid and chemically reactive environments
- π§© Customizable Tempers: Soft (annealed), half-hard, and full-hard options
- Joining requirements β specify the method, surface preparation and atmosphere
- π± Eco-Friendly & Recyclable for sustainable manufacturing
- π Tight Thickness Control for consistent quality in automated processes
- π§² Low Magnetic Permeability for magnetic-sensitive applications
- π¬ C11000 Copper Foil is optimal for research and precision engineering
π οΈ Processing & Available Sizes
Our C11000 Copper Foil is available in various thicknesses and widths with customization support:
- Thickness Range: 0.01 mm β 2.0 mm
- Width: up to 600 mm
- Length: coil or cut-to-length sheets
- Tempers: Annealed (O), Half-Hard (H02), Full-Hard (H04)
- Surface Finish: Bright rolled / Matte / Oxide-free
- Packaging: Vacuum-sealed rolls, moisture-proof wrapping, or cut sheets in crates
Custom shapes and surface treatments available on request (e.g., tin-plated, laminated, etched).
We also offer C11000 Copper Foil pre-treated for easy lamination and coating, enhancing its compatibility with advanced adhesive systems used in aerospace and electronics.
π Typical Applications
C11000 Copper Foil is widely used across industries:
- π¦ Electronics: PCB circuit layers, connector shielding, flexible circuits
- π Energy storage: Lithium battery tabs, solar energy systems
- π§° Electrical engineering: Transformers, stator winding, magnetic coils
- π‘ Communication: EMI/RFI shielding for sensitive devices
- ποΈ Arts & Decoration: Copper crafts, architectural panels, embossing foil
- π Automotive & Aerospace: Grounding straps, EMI gaskets, thermal shunts
- π₯ Medical Devices: Sensor films, diagnostic equipment shielding
- π§ͺ Lab Equipment: Thermal plates, EMI-sealed enclosures
- π§² Shielding Foil: In MRI rooms and X-ray facilities
- πͺ C11000 Copper Foil for numismatic applications and minting prototypes
Product Specification and Requested Documents
- π ASTM B152 β Standard Specification for Copper Sheet, Strip, Plate, and Rolled Bar
- Mill Test Certificate (MTC) β specify the required EN 10204 3.1 documentation
- RoHS and REACH documentation requirements to confirm for the order
- ISO 9001:2015 quality-management documentation required by the project
- π Custom inspection support (SGS, BV, etc.)
π Export & Logistics
- π¦ Secure packaging for global transit
- π§Ύ Full export documentation (COO, MTC, PL, Invoice)
- π’ Shipping terms: EXW / FOB / CIF / DDP
- π Lead time: Typically 5β10 working days
- π Global coverage with multilingual support
π§ Why Choose NiTiCu Metal?
- π Over 10 yearsβ expertise in copper foil production
- π― Precision manufacturing with tight tolerances
- π οΈ Flexible customization for industrial or craft-grade uses
- π¦ Fast turnaround and international delivery
- π© Responsive technical support and quotes within 24 hours
- π§ͺ C11000 Copper Foil experts with professional consultation
- π On-demand traceability and batch-specific documentation
Order C11000 Foil and Strip
Send thickness, width, coil or cut length, temper, finish, quantity and application inspection requirements through our contact page. Browse copper and brass foil. Compare H62 brass foil by material and forming requirements; for oxygen-free plate stock, review C10200 copper plate with its separate grade and supplied form.
Contact Us
π§ Email: sales@niticu.com
π Phone / WhatsApp / WeChat: +86 13335373172
π Factory: Baotai Road Industrial Park, High-tech Zone, Baoji City, Shaanxi, China
π Website: https://niticu.com
π© Contact us now to request a quote, sample, or technical specification sheet!

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