Description
Molybdenum Sputtering Target: 99.95% Mo for PVD
A Molybdenum Sputtering Target is a refractory-metal source material used for physical vapor deposition (PVD), magnetron sputtering, and precision thin-film coating. Molybdenum combines a high melting point, good electrical conductivity, relatively low thermal expansion, and excellent dimensional stability, making it particularly useful in display, photovoltaic, electronic, and vacuum-deposition systems.
NiTiCu supplies 99.95% Molybdenum Sputtering Target material in round, rectangular, planar, and drawing-specific geometries. Target dimensions, surface condition, edge design, tolerance, and backing requirements can be manufactured according to the customer’s actual sputtering equipment.
✦ 99.95% High-Purity Molybdenum
✦ Round / Rectangular / Planar Targets
✦ PVD & Magnetron Sputtering
✦ Display & Thin-Film Solar Applications
✦ Custom Dimensions & Machining
✦ COA / MTC / Inspection Documentation
Rather than limiting customers to only several fixed catalog sizes, each Molybdenum Sputtering Target can be reviewed according to the cathode design and final application.
⚙️ Why Molybdenum Is an Effective Sputtering Material
Molybdenum is a refractory metal with a melting point of approximately 2623°C and a density of approximately 10.28 g/cm³.
For PVD applications, however, high melting temperature alone does not determine target performance.
A good High Purity Molybdenum Target must also provide controlled chemistry, high material integrity, a suitable grain structure, clean machining, and accurate dimensions.
| Target Characteristic | Why It Matters |
|---|---|
| 99.95% Purity | Helps reduce unwanted metallic contamination |
| High Density | Supports target integrity and consistent material removal |
| Uniform Microstructure | Helps reduce local variation across the erosion zone |
| Dimensional Accuracy | Ensures correct installation in sputtering equipment |
| Clean Surface | Reduces contamination before vacuum installation |
| Controlled Edge Geometry | Improves fit and handling |
| Traceable Material | Supports specification-controlled projects |
A Molybdenum Target should therefore be treated as an engineered deposition component rather than ordinary molybdenum plate cut to shape.
📋 Product Specifications
| Item | Typical Supply |
|---|---|
| Product | Molybdenum Sputtering Target |
| Material | Pure Molybdenum |
| Chemical Symbol | Mo |
| Purity | 99.95% |
| CAS No. | 7439-98-7 |
| Density | Approx. 10.28 g/cm³ |
| Melting Point | Approx. 2623°C |
| Form | Round / Rectangular / Planar / Custom |
| Diameter | Custom |
| Width × Length | Custom |
| Thickness | Custom |
| Surface | Machined / Ground / Cleaned |
| Edge | Chamfer / Radius / Customer Drawing |
| Backing Plate | According to requirement |
| Bonding | Subject to technical review |
| Inspection | Chemistry / Dimensions / Surface |
| Documentation | COA / MTC / Inspection Report |
The exact specification of each Molybdenum Sputtering Target should be confirmed before production, particularly where special purity, grain size, flatness, bonding, or dimensional requirements apply.
🧪 Purity & Impurity Control
A nominal purity of 99.95% Mo is suitable for many display, photovoltaic, PVD, and research applications.
However, total purity alone does not tell the complete story.
For a High Purity Molybdenum Target, individual residual elements may also affect thin-film chemistry and electrical properties.
Important elements can include:
W · Fe · Ni · Cu · Si · Al · C · O · N
| Impurity | Why It May Matter |
|---|---|
| Fe / Ni / Cu | Metallic contamination |
| Si / Al | Thin-film composition control |
| W | Refractory-metal residual content |
| C | Purity-sensitive deposition |
| O / N | Film and process chemistry |
| Other Elements | According to customer specification |
Customers with contamination-sensitive processes should provide the maximum acceptable limits for critical impurities.
The actual chemistry of a Molybdenum Sputtering Target can then be confirmed against the agreed purchase specification.
🧬 Density, Grain Structure & Internal Quality
Chemical purity is only one part of a sputtering target specification.
The metallurgical condition of a Mo Sputtering Target can influence erosion behavior, target integrity, and consistency during deposition.
Important factors include:
| Metallurgical Factor | Engineering Importance |
|---|---|
| Density | Reduces undesirable internal porosity |
| Grain Size | May influence sputtering behavior |
| Grain Uniformity | Helps reduce local structural differences |
| Internal Defects | Should be minimized |
| Texture / Orientation | May influence erosion characteristics |
| Heat Treatment | Affects final microstructure |
Depending on the production route and size, molybdenum target material may involve densification, hot working, rolling, heat treatment, machining, and final cleaning.
If a project specifies grain size, density, ultrasonic inspection, or metallographic requirements, those acceptance criteria should be defined before production.
A small research Molybdenum Target and a large industrial display target may require very different metallurgical specifications.
⚡ Stable PVD & Magnetron Sputtering
During magnetron sputtering, energetic ions bombard the surface of the Molybdenum Sputtering Target and eject molybdenum atoms into the vacuum chamber.
These atoms travel toward the substrate and form a thin Mo film.
Stable sputtering therefore depends on several target characteristics working together:
Purity + Density + Microstructure + Surface + Geometry
A consistent Sputtering Target provides a more controlled molybdenum source across the erosion zone.
However, the target is only one part of the deposition process. Film properties also depend on:
Power · Chamber Pressure · Argon Flow · Substrate Temperature · Target Distance · Cathode Design
The role of the Molybdenum Sputtering Target is to provide a clean, stable, and dimensionally accurate source material for the coating system.
📐 Custom Shapes & Dimensions
Different cathodes use different target geometries.
For this reason, NiTiCu supports custom manufacturing according to drawings.
| Target Form | Custom Options |
|---|---|
| Round Target | Diameter and thickness |
| Rectangular Target | Width, length and thickness |
| Planar Target | Drawing-specific |
| Square Target | Custom |
| Chamfer | Customer specified |
| Edge Radius | Customer specified |
| Step / Groove | Subject to technical review |
| Mounting Hole | Drawing based |
| Special Profile | Reviewed individually |
| Rotary Design | Can be reviewed when required |
A drawing is strongly recommended when the Molybdenum Sputtering Target contains holes, steps, grooves, backing structures, or critical tolerance areas.
For replacement projects, the original target drawing or complete dimensional information can be used for technical review.
🧲 Monolithic Targets & Backing Assemblies
A Molybdenum Target may be used as a monolithic component or as part of a backed target assembly.
◈ Monolithic Target
The complete target is manufactured from molybdenum and installed directly into the cathode when the equipment design permits.
◈ Target with Backing Plate
Certain sputtering systems require mechanical support, cooling, or a bonded backing plate.
The correct configuration depends on:
Target Size · Target Thickness · Power Density · Cooling Method · Cathode Structure
Backing and bonding requirements for a Molybdenum Sputtering Target can be reviewed according to the customer’s drawing.
We recommend confirming the actual bonding material and method before quotation rather than assuming that one bonding solution fits every sputtering system.
✨ Surface Finish & Cleanliness
Surface preparation is especially important for vacuum-deposition materials.
After machining, a Mo Sputtering Target may require deburring, grinding, cleaning, and protected handling.
| Surface Requirement | Description |
|---|---|
| Precision Machining | Final dimensional control |
| Ground Surface | Available where appropriate |
| Deburring | Removes sharp machining edges |
| Cleaning | Reduces machining residue |
| Specified Ra | Customer-defined roughness |
| Protected Handling | Helps preserve surface condition |
If surface roughness is important, an actual Ra value is preferable to general descriptions such as “very smooth” or “mirror finish.”
This creates a measurable inspection requirement.
🖥️ Display & Touch-Panel Applications
Display technology is one of the most important application areas for a Molybdenum Sputtering Target.
Molybdenum thin films can be used in conductive layers, electrode structures, and related thin-film components in TFT-LCD and touch-panel systems.
Its combination of conductivity and thermal stability makes Mo suitable for these demanding thin-film structures.
For large-area display coating, important factors may include:
Target Length · Flatness · Grain Uniformity · Surface Quality · Backing Structure
A High Purity Molybdenum Target intended for large-area deposition should therefore be specified according to the actual coating line rather than only by nominal purity.
☀️ Thin-Film Solar Applications
Molybdenum is also widely used in thin-film photovoltaic technology, particularly as a back-contact material in CIGS-type solar cells.
A Molybdenum Sputtering Target provides the Mo source used to deposit this electrically conductive layer.
Important considerations can include:
| Requirement | Why It Matters |
|---|---|
| Film Conductivity | Supports electrical performance |
| Film Adhesion | Important for multilayer structures |
| Target Purity | Controls unwanted contamination |
| Deposition Uniformity | Important for large-area coating |
| Target Surface | Helps maintain stable processing |
Research-scale photovoltaic systems and large production lines may require very different target dimensions and process specifications.
🔬 Other Thin-Film Applications
In addition to displays and solar cells, a Sputtering Target made from molybdenum can also be used in:
| Application | Typical Purpose |
|---|---|
| Thin-Film Research | Experimental Mo coatings |
| Electronics | Conductive and functional films |
| Vacuum Deposition | Controlled molybdenum layers |
| Materials Research | New multilayer systems |
| Functional Coatings | Specialty metallic layers |
| Magnetron Sputtering | Industrial and laboratory PVD |
A Mo Sputtering Target can therefore be suitable for both R&D and production equipment, provided that the target specification matches the actual deposition system.
🔍 Quality Inspection & Traceability
A precision Molybdenum Sputtering Target should be supported by clear quality-control requirements.
Depending on the order, inspection can include:
| Inspection Item | Availability |
|---|---|
| Chemical Composition | ✓ |
| Purity Verification | ✓ |
| Diameter | ✓ |
| Width / Length | ✓ |
| Thickness | ✓ |
| Flatness | When Specified |
| Surface Condition | ✓ |
| Chamfer / Edge Geometry | ✓ |
| Drawing Dimensions | ✓ |
| Metallographic Testing | On Request |
| Third-Party Inspection | On Request |
📄 Documentation
Available documents may include:
COA — Certificate of Analysis
MTC — Material Test Certificate
Chemical Composition Report
Dimensional Inspection Report
Special testing requirements should be identified before production so that they can be included in the inspection plan.
📦 Protective Packaging
After machining and inspection, a Molybdenum Target should be protected against scratches, edge damage, contamination, and impact.
A typical packaging concept includes:
Surface Protection → Clean Wrapping → Rigid Separation → Moisture Protection → Export Packaging
Large or thin targets may require additional support to reduce the risk of deformation during international transportation.
Packaging can also be adapted for backed or bonded target assemblies.
🌐 Why Choose NiTiCu?
NiTiCu focuses on custom refractory and high-purity metal products for industrial and research applications.
For each Molybdenum Sputtering Target, we review the technical requirements before manufacturing.
| Material Control | Custom Manufacturing | Quality Control |
|---|---|---|
| 99.95% Mo | Drawing-based sizes | Chemistry verification |
| Impurity requirements reviewed | Round / rectangular / planar | Dimensional inspection |
| System Compatibility | Documentation | Export Supply |
|---|---|---|
| Backing requirements reviewed | COA / MTC available | Protective packaging |
| Geometry checked before production | Inspection reports | International shipment |
Whether you require a laboratory Molybdenum Target or a larger target for display, photovoltaic, or industrial PVD equipment, the specification can be reviewed according to your actual system.
💬 Contact NiTiCu
Need a custom Molybdenum Sputtering Target for PVD, display, solar, or research applications?
Send your drawing or target specification to NiTiCu. Our team will review the material, purity, dimensions, machining requirements, backing configuration, production feasibility, lead time, and quotation.
+86 133 3537 3172
✉️ Sales Email
RFQs, drawings, replacement-target specifications, and technical requirements are welcome.
⏱ Response Time
Normally within 24 hours
99.95% Mo · Custom Dimensions · PVD Target Supply · Technical Review
Purchasing and Selection FAQ
Does 99.95% molybdenum guarantee a low-resistance film?
No. 99.95% is the nominal molybdenum target purity. Film resistivity, adhesion and uniformity also depend on the substrate, chamber, gases and deposition recipe. Confirm lot chemistry and any critical impurity, density or microstructure requirements before ordering.
When does a molybdenum target require backing or bonding?
The cathode design, target geometry, cooling and operating power determine the assembly. Provide the target and backing drawings and mounting details. Monolithic and bonded designs need separate compatibility review; dimensions and purity alone do not define the thermal or mechanical interface.
Can ordinary molybdenum alloy stock replace this sputtering target?
Do not assume interchangeability. This product specifies 99.95% molybdenum for deposition. TZM, MoLa and other molybdenum materials have different compositions or processing requirements. Specify the required deposited-film chemistry and target acceptance criteria when comparing materials.
Related resources: Aluminum sputtering target · Copper sputtering target · Target RFQ and purchasing guide
For composition differences between molybdenum materials, read Molybdenum alloys: Mo 361, MoLa and TZM.
Technical references: Kurt J. Lesker: target purity, handling and bonded configurations
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