Titanium Sputtering Target | 99.995% / 4N5 Ti

Description

Titanium Sputtering Target: 99.995% / 4N5 Ti for PVD

A Titanium Sputtering Target is a high-purity source material engineered for physical vapor deposition (PVD), magnetron sputtering, and precision thin-film coating processes. Unlike conventional commercially pure titanium products, sputtering-grade titanium places much greater emphasis on purity, impurity control, microstructure, density, surface quality, dimensional accuracy, and compatibility with the deposition system.

NiTiCu supplies 99.995% / 4N5 high-purity titanium targets for research and industrial coating applications. Round, rectangular, planar, and drawing-specific geometries can be manufactured according to the customer’s sputtering system.

✦ 99.995% / 4N5 Titanium
✦ Custom Diameter, Length, Width & Thickness
✦ Round / Rectangular / Planar Targets
✦ Controlled Surface & Dimensional Accuracy
✦ Backing Plate / Bonding Requirements Can Be Reviewed
✦ Material Analysis & Inspection Documentation Available

The product is supplied according to customer specifications rather than limited to a single fixed target dimension.

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⚡ Why Target Purity Matters in PVD

For thin-film deposition, the target is not simply a piece of titanium—it is the source from which sputtered atoms are transferred to the substrate.

Impurities present in the target may therefore influence film chemistry, electrical properties, adhesion, optical behavior, and overall process consistency.

A High Purity Titanium Sputtering Target is especially valuable for processes where contamination must be minimized.

For demanding semiconductor, electronic, optical, or research applications, customers should specify not only total titanium purity but also any critical individual impurity limits.

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🧪 Product Specifications

📌 Custom Product: Target dimensions should be confirmed according to the sputtering cathode, backing plate, mounting method, and deposition equipment.

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🧬 99.995% / 4N5 Titanium Purity

A 99.995% Titanium Sputtering Target contains nominally at least 99.995% titanium, corresponding to a commonly used 4N5 purity designation.

For high-purity sputtering materials, however, the total purity figure is only the beginning of the specification.

Elements that may require individual control include:

Fe · Al · Si · Cr · Ni · Cu · O · N · C · H

The significance of each impurity depends on the final deposited film and process.

For specification-sensitive orders, NiTiCu recommends providing the required maximum impurity limits together with the RFQ.

A 4N5 Titanium Target should therefore be purchased based on both total purity and the actual chemistry report.

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🔍 Microstructure Matters

Purity alone does not determine how a sputtering target performs.

The internal structure of the target is also important.

A well-prepared High Purity Titanium Target should have a controlled and reasonably uniform metallurgical structure across the usable target area.

Important factors include:

Depending on the target specification, material processing may include melting, forging, rolling, heat treatment, machining, surface finishing, and cleaning.

If a project requires a specific grain size, orientation, ultrasonic inspection, or other metallurgical acceptance criteria, these requirements should be stated before production.

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🌀 Stable Sputtering Starts with a Consistent Target

During magnetron sputtering, energetic ions bombard the target surface and eject titanium atoms into the vacuum chamber. These atoms subsequently deposit on the substrate and form a thin titanium-based film.

A consistent Titanium Sputtering Target helps support stable operation by providing a controlled source material throughout the erosion zone.

Three characteristics are particularly important:

✦ Purity

Higher purity helps minimize unwanted elements entering the deposited film.

✦ Microstructure

A more uniform target structure can support more consistent erosion characteristics across the target surface.

✦ Surface Quality

Clean machining and controlled handling reduce the possibility of contamination being introduced before installation.

For high-value PVD systems, target quality should therefore be considered as an integrated combination of:

Chemistry + Microstructure + Density + Dimensions + Surface

rather than purity alone.

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📐 Custom Target Geometry

Different sputtering systems use different cathode dimensions and mounting designs.

For this reason, NiTiCu does not restrict the Titanium Sputtering Target to only a few catalog sizes.

Targets can be manufactured according to customer drawings.

A drawing is strongly recommended when the High Purity Titanium Sputtering Target contains mounting holes, steps, grooves, special edges, or tight tolerances.

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🧲 Monolithic Target or Backing Plate Assembly

Some sputtering systems use a solid monolithic target, while others require the sputtering material to be mounted or bonded to a backing plate.

◈ Monolithic Target

The complete target is machined from high-purity titanium.

This solution may be appropriate when the system design allows a self-supporting titanium target.

◈ Target with Backing Plate

For other cathode designs, the titanium target may need to be assembled with a backing plate.

The actual configuration depends on:

Target Size · Target Thickness · Cooling System · Cathode Design · Operating Power · Customer Drawing

Backing plate and bonding requirements can be reviewed according to the customer’s sputtering system.

⚙️ Important: Please provide the target drawing or existing target dimensions when a backing plate or bonded assembly is required.

This helps avoid compatibility issues during installation.

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✨ Surface Preparation & Cleanliness

Surface condition is particularly important for a 99.995% Titanium Sputtering Target.

After precision machining, the target should be handled carefully to reduce contamination from oil, dust, fingerprints, machining residue, or unsuitable packaging materials.

Possible final requirements include:

When a particular surface roughness is required, we recommend stating the required Ra value rather than using descriptions such as “very smooth” or “mirror finish.”

A measurable specification is much easier to inspect and reproduce.

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🏭 Typical Applications

The Titanium Sputtering Target is used wherever controlled titanium or titanium-based thin films are deposited by physical vapor deposition.

A High Purity Titanium Target can also be used in reactive sputtering processes where titanium reacts with process gases to form titanium-based compound films.

The final film composition depends on the target, process gas, chamber conditions, substrate, power, pressure, and deposition parameters.

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⚙️ Manufacturing & Quality Control

Producing a 4N5 Titanium Target requires more than cutting a disc from ordinary titanium plate.

The manufacturing route must protect purity while achieving the required structure, dimensions, and surface condition.

The exact processing route depends on target dimensions and technical requirements.

For an advanced Titanium Sputtering Target, additional inspection requirements can also be discussed before manufacturing.

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🔍 Inspection & Traceability

Quality control is particularly important when the target will be used in high-value deposition equipment.

Available documentation may include:

COA — Certificate of Analysis
MTC — Material Test Certificate
Chemical Composition Report
Dimensional Inspection Report

For semiconductor or other contamination-sensitive projects, customers should specify any additional analysis or acceptance requirements before production.

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📦 Clean & Protective Packaging

High-purity targets require packaging that protects both the material surface and dimensional condition.

A finished Titanium Sputtering Target can be individually protected after final inspection and cleaning.

📦 Packaging Focus

Surface Protection → Clean Wrapping → Individual Separation → Moisture Protection → Rigid Export Packaging

The exact packaging method is selected according to target geometry, quantity, backing configuration, and shipping method.

For a 99.995% Titanium Sputtering Target, minimizing unnecessary handling after final cleaning is particularly important.

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🌐 Why Choose NiTiCu?

For sputtering materials, NiTiCu focuses on purity control, custom dimensions, technical review, and traceable supply, rather than treating the product as ordinary titanium stock.

Whether you require a laboratory High Purity Titanium Target or a custom target for an industrial PVD system, the material and dimensions can be reviewed according to your actual equipment.

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💬 Contact NiTiCu

Need a custom Titanium Sputtering Target for your PVD or magnetron sputtering system?

Send us your drawing or target specification and our team will review the purity, dimensions, manufacturing feasibility, backing requirements, lead time, and quotation.

📱 WhatsApp

+86 133 3537 3172
https://wa.me/8613335373172

✉️ Sales Email

sales@niticu.com
For RFQs, drawings, purity requirements, and technical specifications.

⏱ Response Time

Normally within 24 hours

99.995% / 4N5 · Custom Dimensions · PVD Target Manufacturing · Technical Review

Purchasing and Selection FAQ

Does 99.995% titanium guarantee the deposited film quality?

No. 99.995% / 4N5 describes the nominal titanium source purity. Film chemistry and performance also depend on chamber cleanliness, gases, substrate and deposition settings. Request lot chemistry and define critical Fe, O, N, C or H limits and the analysis basis before ordering.

Does this titanium target need a backing plate or bonding?

That depends on the cathode. Provide the target and backing drawings, mounting interface, cooling arrangement and operating power. A monolithic target or bonded assembly must match the equipment; a backing plate is not automatically included.

Can a titanium target be used for reactive sputtering?

Yes, where the deposition system supports the required reactive process. The metallic Ti target supplies titanium; gas chemistry and process settings determine the resulting compound film. Specify whether the intended film is metallic titanium or a titanium-based compound in the RFQ.

Related resources: Aluminum sputtering target · Chromium sputtering target · Target RFQ and purchasing guide

Technical references: Kurt J. Lesker: target purity, handling and bonded configurations